In the previous post I mentioned that there was a problem with cooling of my new CPU. The Antec Kuhler 620 CPU that I had been using to cool it was not up to the task. The CPU was touching TJ-max kind of core temperature when stress tested using OCCT 4.4.
There was one thing for me to do: reseating of the water block.
I had some free time in the last weekend as the baby went into his regular evening nap, so I went down to business.
Almost all the guides out there recommend that you use a tiny amount of thermal paste in the middle of the heat spreader and let the pressure from of the heatsink mounting mechanism spread and thin the paste. I followed the same guide. But when this method is employed, the spread become a circular area and the edges don’t get proper contact with the heatsink. I thought the thermal issues that I had were caused by this contact issue. I cannot remember if I mentioned this before, but the pressure from the mounting mechanism seemed insufficient. The spread could be better with other heatsinks with better mounting pressure.