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Showing posts with label gum. Show all posts
Showing posts with label gum. Show all posts

Thursday, August 22, 2013

[Article] To de-lid my Haswell 4770K CPU or not?

Haswell runs hot compared to SandyBridge. IvyBridge also ran hot, but Haswell runs even hotter than that because of the existence of FIVR (Fully Integrated Voltage Regulator). SandyBridge CPUs had the heatspreader soldered to the die thus having good heat transfer from die to the heatspreader. IvyBridge and Haswell both don't have it soldered. Instead, they have a thermal paste in between the die and the heatspreader. Intel is cheaping out.

The thermal paste itself isn't the issue. The biggest issue is that the "large" gap between the die and the heatspreader that requires a thicker than ideal layer of thermal paste. This gab is caused by the thick layer of glue that holds the heatspreader in place.

The only option is to either lower the temps by lowering voltages thus lowering the overclock OR to de-lid the CPU. That means, you pop open the heatspreader, scrub off the glue, clean off the thermal paste, put a better thermal paste and putting back the heatspreader. If properly done, people have been seeing up to 30°C drop in temps after doing this. THAT is massive.

Lower temps help overclock higher, or run your fans at a lower RPM. But it also lowers the power consumption of the CPU. What? How's that possible? It has something to do with these Tri-gate transistors. More voltage obviously increases power consumption. Higher temps also increase power consumption. Well, if you use power saving features - and your should - this will only happen at full load.

I compiled a list of FAQ below and will keep adding more stuff as time goes by.


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